Multicore MP218 solder paste is a halide-free, no clean, pin testable solder paste which has excellent humidity resistance and a broad process window, both for reflow and printing. MP218 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.