MulticoreTM LF700 solder paste is a halide-free, no clean, Pb- free solder paste, which has a broad process window, for printing, reflow and humidity resistance. LF700 solder paste has been formulated to give low voiding in BGA joints, a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.