LOCTITE LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has high tack force to resist component movement during high speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.